Composite active-matrix substrates, methods for manufacturing same, and electromagnetic wave capturing devices

ABSTRACT

A composite active-matrix substrate includes: a plurality of active-matrix substrates which are disposed adjacent to one another; a base substrate which is disposed to oppose a bottom surface of the active-matrix substrates; a sealant which is disposed in the form of a frame between the active-matrix substrate and the base substrate; a first filler which fills a spacing surrounded by the active-matrix substrate, the base substrate, and the sealant; and a second filler which fills a gap between edges of the active-matrix substrates. The sealant prevents the first filler from seeping out. In this way, seeping of an adhesive filler can be prevented in the arrangement where a plurality of active-matrix substrates are fixed on the base substrate using the adhesive filler. An electromagnetic wave capturing device according to the present invention uses such a composite active-matrix substrate.

FIELD OF THE INVENTION

The present invention relates to electromagnetic wave capturing deviceswhich detect electromagnetic waves including radiation such as X-rays,visible light, and infrared light. The invention also relates tocomposite active matrix substrates for use in the electromagnetic wavecapturing devices, and methods for manufacturing the composite activematrix substrates.

BACKGROUND OF THE INVENTION

Conventionally, an active-matrix substrate, which is provided with pixelelectrodes and switching elements disposed in a two-dimensional manner,finds wide application in devices such as a display device and acapturing device. For example, demand for the active matrix substrate asmonitors for an audio/visual device and an office automation device hasbeen rapidly increasing. Examples of such a display device and acapturing device include liquid crystal display devices (LCDs: LiquidCrystal Displays), which are expected for application to a flat TV, andx-ray capturing devices (FPXDs: Flat Panel X-ray Detectors), which arecapable of directly reading out x-ray images in the form of electricsignals without an film.

The active matrix substrate for use in such a display device and acapturing device includes thin film transistors (TFTs) of metal wiringand semiconductor, which are precisely arrayed in a matrix pattern on aninsulating substrate such as a glass substrate. Manufacture of theactive matrix substrate requires highly sophisticated processingtechniques such as photolithography and expensive manufacturingequipment. This has made it difficult to manufacture a large-areaactive-matrix substrate because the yield dropped drastically as thearea or resolution of the active-matrix substrate was increased. Anotherproblem is that once the manufacturing equipment is built, it isimpossible to manufacture an active-matrix substrate which is largerthan the substrate size suitable for the manufacturing equipment. Thatis, it has been difficult to manufacture a large active-matrix substrateto accommodate the increased size of display devices or capturingdevices.

As a counter-measure for these problems, there have been proposedmethods of forming a composite active-matrix substrate by connecting aplurality of small active-matrix substrates. For example, “Large AreaLiquid Crystal Display Realized by Tiling of Four Back Panels(Proceedings of the 15th International Display Research Conference (ASIADISPLAY '95, pp. 201-204 (1995)))” (reference 1) discloses anarrangement of a composite active-matrix substrate for use in liquidcrystal display devices. Further, U.S. Pat. No. 5,827,757 (reference 2),published on Oct. 27, 1998, discloses a method for manufacturing acomposite active-matrix substrate and an x-ray capturing deviceutilizing the composite active-matrix substrate.

The active-matrix substrate described in the above reference 1, as shownin FIGS. 13(a) through 13(c), is fabricated as follows: after four smallactive-matrix substrates 101, with their element bearing sides 101 afacing down, are aligned on a stage 103 with a vacuum chuck, a back side(upper side in FIG. 13(a)) of the active-matrix substrates 101 is bondedto a base substrate 102 with an adhesive resin 105. Here, the adhesiveresin 105 contains a spacer 104. Further, an ultraviolet curable resinis used for the adhesive resin 105.

Meanwhile, the composite active-matrix substrate described in the abovereference 2, as shown in FIGS. 14(a) through 14(g), is made up of aplurality of small active-matrix substrates 111 bonded to a basesubstrate 112. Specifically, this composite active-matrix substrate isfabricated in the following manner: after an edge of the active-matrixsubstrate 111 whose element bearing side is covered with a protectingfilm 121 is cut by dicing and polished (see FIGS. 14(a) and 14(b)), theplurality of active-matrix substrates 111, with their element bearingsides facing down, are aligned on a stage 113 and connected to eachother with an adhesive resin 141 which fills a gap between theactive-matrix substrates 111 (see FIGS. 14(c) and 14(d)). Thereafter, aback side (upper side in FIG. 14(d)) of the plurality of active-matrixsubstrates 111 is bonded to a base substrate 112 with an adhesive resin131. Then, after the active-matrix substrates 111 are removed from thestage 113, the protecting film 121 is peeled off from the active-matrixsubstrates 111 (see FIGS. 14(e) through 14(g)). Here, formation of alarge number of orderly openings (holes for releasing an adhesive resin)112 a prevents air bubbles from being trapped in the adhesive resin 131which fills a spacing between the active-matrix substrate 111 and thebase substrate 112, and helps excess adhesive resin 131 to escape.

However, the foregoing conventional composite active-matrix substratesand manufacturing methods have the following problems. For example, thecomposite active-matrix substrate described in the reference 1 appearsto be manufactured in such a way that the plurality of active-matrixsubstrates 101 aligned together, coated with the adhesive resin 105having fluidity, are bonded to the base substrate 102. Here, theplurality of active-matrix substrates 101 must be bonded with the basesubstrate 102 in a state where a distance between these two substratesis at the distance of a gap determined by a spacer. This causes aproblem that the adhesive resin 105 seeps out (pressed out) of theactive-matrix substrate 101. As a result, it becomes difficult toprevent air bubbles from being trapped in the adhesive resin 105, andcleaning of the excess adhesive resin 105 will be required. This resultsin a problem that workability suffers significantly.

On the other hand, in the composite active-matrix substrate described inthe above reference 2, theoretically, a large number of openings 112 aformed in advance on the base substrate 112 can prevent air bubbles frombeing trapped, and excess adhesive resin 131 can escape through theopenings 112 a when the base substrate 112 and the active-matrixsubstrate 111 are bonded. However, in cases where a comparatively largecomposite active-matrix substrate is to be manufactured, the basesubstrate 112 cannot be pressed down (toward the active-matrix substrate111) uniformly over the surface when it is bonded. This results in aproblem that air bubbles and the adhesive resin 131 cannot be releasedproperly at portions of the base substrate 112 where the appliedpressure is weaker, or at thinner portions of the base substrate 112. Inaddition, forming the large number of openings 112 a on the basesubstrate 112 increases manufacturing costs. Further, cleaning of excessadhesive resin 131 which has seeped out through the opening 112 a isstill required, resulting in a problem that workability sufferssignificantly.

Further, in the composite active-matrix substrate described in the abovereference 2, a rubber squeegee (not shown) is used to fill a gap betweenthe small active-matrix substrates 111 with the adhesive resin 141. Thiscauses problems that the adhesive resin 141 is likely to spread to thetop surface (element bearing side) of the active-matrix substrate 111,and an external force is applied to the active-matrix substrate 111through the rubber squeegee. Thus, filling of the adhesive resin 141required an extremely thick protecting film 121 which covered the topsurface of the active-matrix substrate 111.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a compositeactive-matrix substrate of a structure in which a plurality of smallactive-matrix substrates are fixed on a base substrate, which can befabricated without such deficiencies as seeping of an adhesive resin(adhesive filler) used to fix the small active-matrix substrates, ortrapping of air bubbles. Another object of the present invention is toprovide a method for manufacturing such a composite active-matrixsubstrate, and to provide an electromagnetic wave capturing device usingsuch a composite active-matrix substrate.

In order to achieve this object, a composite active-matrix substrateaccording to the present invention includes: a plurality ofactive-matrix substrates, each having a top surface with an activeelement, which are disposed adjacent to one another so that the topsurfaces of the active-matrix substrates make up a substantially levelsurface; a base substrate, which is provided so as to oppose a bottomsurface of the active-matrix substrates; a sealant, which is provided inthe form of a frame between the bottom surface of each active-matrixsubstrate and the base substrate; an adhesive filler A, which fills aspacing surrounded by the base substrate, the sealant, and eachactive-matrix substrate; and an adhesive filler B, which fills a gapbetween edges of the active-matrix substrates which are disposedadjacent to one another.

With this arrangement, the sealant prevents seeping of the adhesivefiller A, and therefore prevents surface contamination of theactive-matrix substrates due to adhesive filler A, thereby realizing acomposite active-matrix substrate with each active-matrix substratefirmly fixed on the base substrate.

Further, in order to achieve the foregoing object, another compositeactive-matrix substrate according to the present invention includes: aplurality of active-matrix substrates, each having a top surface with anactive element, which are disposed adjacent to one another so that thetop surfaces of the active-matrix substrates make up a substantiallylevel surface; a base substrate, which is provided so as to oppose abottom surface of the active-matrix substrates; a gel sticking material,which is provided between the bottom surface of each active-matrixsubstrate and the base substrate, for combining each active-matrixsubstrate with the base substrate; and an adhesive filler B, which fillsa gap between edges of the active-matrix substrates which are disposedadjacent to one another.

With this arrangement, since the adhesive filler used to fill a spacingbetween each active-matrix substrate and the base substrate is the gelsticking material which has high flexibility but no fluidity, theadhesive filler does not contaminate the surface of each active-matrixsubstrate, and a composite active-matrix substrate with eachactive-matrix substrate firmly fixed on the base substrate can beprovided.

Further, in order to achieve the foregoing object, another compositeactive-matrix substrate according to the present invention includes: aplurality of active-matrix substrates, each having a top surface with anactive element, which are disposed adjacent to one another so that thetop surfaces of the active-matrix substrates make up a substantiallylevel surface; a base substrate, which is provided so as to oppose abottom surface of the active-matrix substrates; a double-sided adhesivesheet, provided between the bottom surface of each active-matrixsubstrate and the base substrate, having a top surface and a bottomsurface respectively provided with sticking layers for combining thebase substrate with each active-matrix substrate; and an adhesive fillerB, which fills a gap between edges of the active-matrix substrates whichare disposed adjacent to one another.

With this arrangement, since the adhesive filler used to fill a spacingbetween each active-matrix substrate and the base substrate is thedouble-sided adhesive sheet of a solid form, the adhesive filler doesnot contaminate the surface of each active-matrix substrate, and acomposite active-matrix substrate with each active-matrix substratefirmly fixed on the base substrate can be provided.

In order to achieve the foregoing object, an electromagnetic wavecapturing device according to the present invention includes: one of theforegoing composite active-matrix substrates; a conversion layer,provided on the top surface of the active-matrix substrates, forconverting an electromagnetic wave into electrical charge; and a biasapplying electrode layer provided on the conversion layer.

Further, in order to achieve the foregoing object, anotherelectromagnetic wave capturing device according to the present inventionincludes: one of the foregoing composite active-matrix substrates; ascintillator, provided on the top surface of the active-matrixsubstrates, for converting an electromagnetic wave into light; and aphoto-electric conversion element, provided on the active-matrixsubstrates, for converting light into electrical charge.

With either arrangement, because the composite active-matrix substrateis composed of a plurality of active-matrix substrates tiled together, alarge-area yet inexpensive electromagnetic wave capturing device can beprovided.

In order to achieve the foregoing object, the present invention providesa method for manufacturing a composite active-matrix substrate whichincludes: a plurality of active-matrix substrates, each having a topsurface with an active element, which are disposed adjacent to oneanother so that the top surfaces of the active-matrix substrates make upa substantially level surface; and a base substrate, which is providedso as to oppose a bottom surface of the active-matrix substrates, themethod including the steps of: forming a sealant in the form of a framebetween the base substrate and the bottom surface of each active-matrixsubstrate, so as to connect the base substrate with each active-matrixsubstrate via a sealant; and injecting an adhesive filler A into aspacing surrounded by the base substrate, the sealant, and eachactive-matrix substrate through an opening which opens into the spacingthrough at least one of the base substrate, the sealant, and eachactive-matrix substrate.

With this method, the adhesive filler A is prevented from seeping out ofa spacing surrounded by the sealant, and therefore the adhesive filler Adoes not contaminate the surface of the active-matrix substrate, therebyfurther improving the efficiency of using the adhesive filler A and theefficiency of combining each active-matrix substrate with the basesubstrate.

Further, in order to achieve the foregoing object, the present inventionprovides another method for manufacturing a composite active-matrixsubstrate which includes: a plurality of active-matrix substrates, eachhaving a top surface with an active element, which are disposed adjacentto one another so that the top surfaces of the active-matrix substratesmake up a substantially level surface; and a base substrate, which isprovided so as to oppose a bottom surface of the active-matrixsubstrates, the method including the steps of: providing a gel stickingmaterial between the base substrate and the bottom surface of eachactive-matrix substrate; and combining the base substrate and theactive-matrix substrates with the gel sticking material.

With this method, since the adhesive filler is a gel sticking materialwhich has high flexibility but no fluidity, the adhesive filler does notcontaminate the surface of the active-matrix substrate when combiningthe substrates. In addition, the gel sticking material, because it isflexible, can completely fill the gap between the substrates.

Further, in order to solve the foregoing object, the present inventionprovides another method for manufacturing a composite active-matrixsubstrate which includes: a plurality of active-matrix substrates, eachhaving a top surface with an active element, which are disposed adjacentto one another so that the top surfaces of the active-matrix substratesmake up a substantially level surface; and a base substrate, which isprovided so as to oppose a bottom surface of the active-matrixsubstrates, the method including the steps of: providing, between thebase substrate and the bottom surface of each active-matrix substrate, adouble-sided adhesive sheet having a top surface and a bottom surfacerespectively provided with sticking layers; and combining the basesubstrate and the active-matrix substrates with the double-sidedadhesive sheet.

With this method, since the adhesive filler is a double-sided adhesivesheet of a solid form, the adhesive filler does not contaminate thesurface of the active-matrix substrates when the substrates arecombined.

Further, in order to solve the foregoing object, the present inventionprovides another method for manufacturing a composite active-matrixsubstrate which includes: a plurality of active-matrix substrates, eachhaving a top surface with an active element, which are disposed adjacentto one another so that the top surfaces of the active-matrix substratesmake up a substantially level surface; and a base substrate, which isprovided so as to oppose a bottom surface of the active-matrixsubstrates, the method including the steps of: fixing the active-matrixsubstrates on the base substrate so that the top surfaces of theactive-matrix substrates disposed adjacent to one another make up asubstantially level surface; and injecting an adhesive filler B bycapillary action between edges of the active-matrix substrates which aredisposed adjacent to one another, so as to bond the active-matrixsubstrates with one another.

With this method, the adhesive filler B can fill a gap between edges ofthe active-matrix substrates without causing the adhesive filler B tostick to the top surface of each active-matrix substrate and withoutexternally applying any physical force onto the surface of eachactive-matrix substrate.

For a fuller understanding of the nature and advantages of theinvention, reference should be made to the ensuing detailed descriptiontaken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1(a) is a schematic plan view of a composite active-matrixsubstrate according to one embodiment of the present invention, and

FIG. 1(b) is a cross sectional view of the composite substrate of FIG.1(a) taken along the line A-A′.

FIG. 2 is a cross sectional view magnifying a juncture of the compositeactive-matrix substrate of FIG. 1(a) and FIG. 1(b).

FIG. 3(a) through FIG. 3(g) are drawings explaining manufacturing stepsof the composite active-matrix substrate shown in FIG. 1(a) and FIG.1(b).

FIG. 4 is a drawing showing one manufacturing step of the compositeactive-matrix substrate shown in FIG. 1(a) and FIG. 1(b).

FIG. 5 is a drawing explaining another manufacturing step of thecomposite active-matrix substrate shown in FIG. 1(a) and FIG. 1(b).

FIG. 6(a) is a schematic plan view of a composite active-matrixsubstrate according to another embodiment of the present invention, and

FIG. 6(b) is a cross sectional view of the composite substrate of FIG.6(a) taken along the line B-B′.

FIG. 7 is a cross sectional view magnifying a juncture of the compositeactive-matrix substrate shown in FIG. 6(a) and FIG. 6(b).

FIG. 8(a) through FIG. 8(g) are drawings showing manufacturing steps ofthe composite active-matrix substrate of FIG. 6(a) and FIG. 6(b).

FIG. 9(a) is a schematic plan view of a composite active-matrixsubstrate according to yet another embodiment of the present invention,and

FIG. 9(b) is a cross sectional view of the composite substrate shown inFIG. 9(a), taken along the line C-C′.

FIG. 10 is a cross sectional view magnifying a juncture of the compositeactive-matrix substrate of FIG. 9(a) and FIG. 9(b).

FIG. 11(a) through FIG. 11(g) are drawings explaining manufacturingsteps of the composite active-matrix substrate of FIG. 9(a) and FIG.9(b).

FIG. 12 is a drawing schematically showing an electromagnetic wavecapturing device according to the present invention.

FIG. 13(a) through FIG. 13(c) are drawings schematically showing aconventional composite active-matrix substrate.

FIG. 14(a) through FIG. 14(g) are drawings showing manufacturing stepsof another conventional composite active-matrix substrate.

DESCRIPTION OF THE EMBODIMENTS

[First Embodiment]

The following will describe one embodiment of the present invention withreference to the accompanying drawings. It should be noted here that thescope of the present invention is not limited in any ways by thefollowing descriptions.

As shown in FIG. 1(a) and FIG. 1(b), a composite active-matrix substrate11 a according to the present invention is composed of a singlelarge-area base substrate 12 and two smaller active-matrix substrates13, wherein the active-matrix substrates 13 are placed adjacent to eachother on the base substrate 12 so that the top surface (active elementbearing surface) of one active-matrix substrate 13 is substantiallylevel with that of the other. The top surface of each active-matrixsubstrates 13 makes up an active-matrix element bearing part 13 a whichis provided with various elements such as active elements, scanningsignal lines, data signal lines, pixel electrodes, and the like (notshown). The composite active-matrix substrate 11 a is structured suchthat the other surface (bottom surfaces) of the active-matrix substrates13 is mated with the base substrate 12 to expose the top surfaces of theactive-matrix substrates 13. Note that, as to the structure of theactive element bearing part 13 a and a manufacturing method thereof,detailed explanations are omitted here because they are the same asthose employed by conventional active-matrix substrates. Further,examples of the active elements include TFT (Thin Film Transistor)elements and MIM (Metal Insulator Metal) elements.

The active-matrix substrates 13 and the base substrate 12 are combinedwith each other via a sealant 14 and a first filler (first adhesivefiller, adhesive filler A) 15 having an adhesive property. The sealant14 is provided for each active-matrix substrate 13 between the bottomsurfaces of the active-matrix substrates 13 and the base substrate 12.The sealant 14 is in the form of a frame or a ring along the peripheryof the bottom surface of each active-matrix substrate 13. The firstfiller 15 fills a spacing created by each active-matrix substrate 13,the base substrate 12, and the sealant 14 (i.e., spacing between thebottom surface of each active-matrix substrate 13 and the base substrate12).

As shown in FIG. 2, a second filler (second adhesive filler, adhesivefiller B) 16 having an adhesive property fills a gap (side gap) at ajuncture of the two active-matrix substrates 13, so as to bond the sidesof the active-matrix substrates 13. The second filler 16 also fills agap between the sealants 14 so as to reduce a spacing between theactive-matrix substrates 13 and the base substrate 12 as much aspossible. Note that, the first filler 15 and the second filler 16 willbe described in more detail later in connection with a manufacturingmethod of the composite active-matrix substrate 11 a, with reference totheir specific examples.

Incidentally, in the composite active-matrix substrate 11 a, the sealant14 is provided in the form of a rectangular frame along the periphery ofthe bottom surface of each active-matrix substrate 13. However, theshape of the sealant 14 is not particularly limited as long as it isprovided between the bottom surface of each active-matrix substrate 13and the base substrate 12, and as long as it is shaped in the form of aframe to prevent leaking or seeping of the first filler 15. For example,the sealant 14 may be in the form of a rectangular frame which issmaller in size than the one previously described, or in the form of aring. Note that, in order to reduce a spacing between the sealants 14,it is particularly preferable that the sealants 14 are in the form of aframe along the periphery of the bottom surface of the active-matrixsubstrate 13.

Referring to FIG. 3(a) through FIG. 3(g), and FIG. 4 and FIG. 5, thefollowing describes a manufacturing method of the compositeactive-matrix substrate 11 a in detail.

First, in step (1), using a process well-known in the field of liquidcrystal display, the active element bearing part 13 a including activeelements, scanning signal lines, data signal lines, and the like isformed on a surface of an insulating substrate 13 b, so as to make theactive-matrix substrate 13 of a small size (FIG. 3(a)). The type ofinsulating substrate 13 b is not particularly limited as long as it isan active-matrix substrate. For example, the non-alkaline glass #1737 ofCorning Inc. can be used. On the insulating substrate 13 b is formed anelement structure (shown as active element bearing part 13 a) including:(1) an array of metal wiring (scanning signal lines, data signal lines,etc.), (2) a plurality of active elements made up of thin-filmtransistor elements (TFT elements) having a semiconductor layer of a-Si(amorphous silicon) or p-Si (polysilicon), or made up of diode elements(MIM elements) of an MIM structure, and (3) a pixel electrode which isprovided for each pixel. The result is the active-matrix substrate 13.

Then, a surface protective film 20 is formed on the element bearingsurface (top surface) of the active-matrix substrate 13 (FIG. 3(a)). Thesurface protective film 20 is provided to protect the active-matrixsubstrate 13 from contamination or damage in the subsequent substratecutting step (step (2)) or substrate combining steps (step (4) throughstep (6)). Further, because the surface protective film 20 needs to becompletely removed at the end of the substrate combining steps, thesurface protective film 20 is required to have such a property that itcan be easily removed, while protecting the surface of the active-matrixsubstrate 13. To this end, the surface protective film 20 is realizedby, for example, an IPA (isopropyl alcohol)-soluble temporary protectivefilm chiefly made of acrylic resin, which is applied over the surface ofthe active-matrix substrate 13 to a thickness of about 3 μm using a spincoater. The property of the surface protective film 20 is such that itis insoluble in water but highly soluble in IPA (surface protective filmremoving agent). This enables the surface protective film 20 to beeasily detached and removed at the end of the fabrication, without beingdissolved and detached in the rinsing process which uses water. Notethat, the surface protective film 20 is not just limited to theIPA-soluble film whose main component is acrylic resin. Instead, othervarious temporary protective films which are soluble in alkalinesolutions or other organic solvents (surface protective film removingagent) may also be used. Further, instead of spin coating, othertechniques, such as dry-film transfer or spraying may be used to formthe surface protective film 20.

In subsequent step (2), the active-matrix substrate 13 of a small sizeis diced to expose the side (edge) which is to be connected to the otheractive-matrix substrate 13 (FIG. 3(b)). Dicing is accurately made sothat the side of the active element bearing part 13 a of oneactive-matrix substrate 13 matches that of the other. Dicing using adiamond blade is suitable for this purpose. A diamond blade having aparticle size of #400 to #800 is particularly preferable. In order toimprove processing accuracy, the diced surface may be optionallypolished. By polishing, the chipping area on the edge of the dicedsurface can be leveled to provide a surface (edge) at desirableaccuracy.

In step (3), two or four of the active-matrix substrate 13 obtained instep (2) are aligned adjacent to one another so that the edges of thediced surfaces oppose one another and a gap between the edges is nowider than the pixel pitch (FIG. 3(c)). For example, a plurality ofactive-matrix substrates 13 are aligned on a highly-flat stage 21equipped with a vacuum chuck (not shown), with their active elementbearing parts 13 a (top surfaces) facing the stage 21. The active-matrixsubstrates 13 so aligned are fixed in position by the vacuum chuck. Inthis way, the surface flatness of the plurality of active-matrixsubstrates 13 can be optimized.

In step (4), a sealant (adhesive resin) 14 is applied on one surface ofa base substrate 12, for which a glass substrate is used, for example(FIG. 3(d)). The sealant 14 is patterned, for example, along the outerperiphery of the bottom surface of the target active-matrix substrate13. The sealant 14 may be a conventional sealant known in the field ofliquid crystal display, for example, such as a heat-curable orlight-curable epoxy resin or acryl resin, or a silicon resin which iscured at room temperature. The sealant 14 is applied (drawn) by screenprinting or by using a dispenser.

Thereafter, the base substrate 12 is combined with the active-matrixsubstrates 13 via the sealant 14. Here, a spacer (gap retainer) 14 a,such as beads or fibers are added to the sealant 14 as required.Alternatively, the spacer (gap retainer, not shown) may be dispersed ordisposed over at least one of the opposing surfaces of the basesubstrate 12 and the active-matrix substrates 13. The provision of thespacer between the base substrate 12 and the active-matrix substrates 13enables a spacing between the two substrates to be maintained at asubstantially constant distance. This further improves surface flatnessof the active-matrix substrates 13. Note that, the sealant 14 may alsobe applied (drawn) on the active-matrix substrates 13, instead of thebase substrate 12.

In step (5), the first filler 15 is injected into a gap surrounded byeach active-matrix substrate 13, the base substrate 12, and the sealant14 (FIG. 3(e), FIG. 4). In this step, the first filler 15 is injectedinto the gap through one of openings (inlet or outlet) 12 b which havebeen provided through the base substrate 12, for example, as shown inFIG. 4. The openings 12 b open into the gap (spacing A) surrounded byeach active-matrix substrate 13, the base substrate 12, and the sealant14. Two openings 12 b are provided for each spacing A, one of which isused to inject the first filler 15, and the other is used to vent. Inthis way, the first filler 15 can easily be injected. Note that, theopening used to inject the first filler 15 into the spacing A may beprovided through the active-matrix substrates 13 or the sealant 14.Further, the first filler 15 may be injected into the spacing A by avacuum injection method by evacuating the spacing A.

The first filler 15 is preferably made of a curable resin of such aproperty that it is a fluid when being injected and is cured after theinjection. Examples of such curable resins include light-curable resins,heat-curable resins, and two-component curable resins, among which thelight-curable resins of a single component are particularly preferablebecause they become curable shortly after the injection, withoutundergoing change in viscosity when being injected. Examples of suchlight-curable resins include acrylic resin or epoxy resin. Further, theviscosity of the first filler 15 before curing, which is notparticularly limited as long as it allows the first filler 15 to beinjected through the opening 12 b, is preferably from 40 cP to 300 cP,because a lower viscosity value enables the injection to be made moresmoothly.

Specific examples of first filler 15 (light-curable resin of a singlecomponent) having a viscosity value in the range of from 40 cP to 300 cPbefore curing are UV curable adhesive agents such as the EpoxyTechnology product OG146-2 (viscosity of about 200 cP), the KyoritsuChemical & Co., Ltd. product World Lock XOC-03H2 (viscosity of about 180cP), and the Adell & Co., Ltd. product OPTOKLEB V300 (viscosity of about300 cP). When using these UV curable adhesive agents as the first filler15, the adhesive agent after the injection is cured by irradiation of UVlight through the base substrate 12, which is light transmissive, usinga chemical UV fluorescent lamp.

In step (6), the second filler 16 is injected into a gap 13 c betweenthe edges of the active-matrix substrates 13 (FIG. 3(f), FIG. 5). Inthis step, for example, using an injector 22, the second filler 16 isinjected by capillary action from one end of the gap (spacing) 13 cbetween the edges of the adjacent active-matrix substrates 13 (FIG. 5).According to this method, the second filler 16 only fills the gap 13 ccreated between the cut edges of the active-matrix substrates 13 and agap between the sealants 14 below the gap 13 c. Under usualcircumstances, this prevents the second filler 16 from sticking to thesurface of the active-matrix substrates 13 (more specifically, surfaceof the surface protecting film 20), thereby making it easier to injectthe second filler 16 while suppressing surface contamination of theactive-matrix substrates 13 to minimum.

Note that, a width of the groove (gap 13 c) filled with the secondfiller 16 is preferably within the pixel pitch, and usually 10 μm to 150μm. Therefore, in order to allow the second filler 16 to quickly fillthe gap 13 c by capillary action, it is particularly preferable that thesecond filler 16 is made of a material with a low viscosity value.Results of experiment have shown that an adhesive resin (filler) havinga viscosity value of from 5 cP to 200 cP is particularly preferable.Further, in order to realize smooth and sufficient injection bycapillary action, a width of the gap 13 c between the active-matrixsubstrates 13 within the range of from 20 μm to 150 μm was found to beparticularly preferable. Note that, these preferable viscosity ranges ofthe adhesive resin or the preferable width ranges of the gap 13 c aregiven merely as examples and these ranges are by no means limiting.

Further, the second filler 16 may be made of an adhesive resin, such asan acrylic resin, which is anaerobic when curing (i.e., adhesive resinwhich is hardly cured in air). However, since the second filler 16 isexposed to air on the surface of the gap 13 c, curing defect may beincurred at this exposed portion. In this case, the organic componentand/or organic impurity (one component of the second filler 16) whichhave seeped out of this defect portion may cause contamination on theactive-matrix substrates 13. Thus, the second filler 16 should morepreferably be an adhesive resin, such as an epoxy resin, which is notanaerobic when curing (i.e., adhesive resin which is curable in air).Note that, by “not being anaerobic when curing”, it means that thematerial is curable in air, and it does not necessarily mean that acuring reaction is initiated or promoted in the presence of air.

Specific examples of adhesive resins which are curable in air and have aviscosity value of 5 cP to 200 cP are UV curable adhesive agents (UVcurable resin) such as the Epoxy Technology product OG 146 (viscosity ofabout 40 cP or less). When using such a UV curable adhesive agent, theadhesive agent injected into the gap 13 c is cured by irradiation of UVlight through the active-matrix substrates 13, using a chemical UVfluorescent lamp. In this way, the second filler 16 exposed on thesurface can also be cured desirably without leaving the tackingproperty.

Though not shown in FIG. 3(a) through FIG. 3(g), and FIG. 4 and FIG. 5,the manufacturing steps of the active-matrix substrates 13 includes awashing step in which water is often used. Here, by ensuring curing ofthe second filler 16 exposed on the surface, seeping of the organiccomponent and/or organic impurity from the exposed surface can besuppressed to minimum, thereby avoiding surface contamination of theactive-matrix substrates 13 without fail.

Finally, in step (7), the surface protecting films 20 on the surface ofthe active-matrix substrates 13 are detached and removed (FIG. 3(g)).For example, when the surface protecting film 20 is the IPA solubletemporary protecting film whose main component is an acrylic resin, thecomposite active-matrix substrate 11 with the surface protecting films20 are dipped in IPA, followed by water, and dried. Note that, it ismore preferable to apply an ultrasonic wave in IPA.

In the manufacturing method of the composite active-matrix substrateaccording to the present embodiment, the first filler (adhesive resin)15 fills a spacing surrounded by each active-matrix substrate 13, thebase substrate 12, and the sealant 14 which is formed in the form of aframe along the periphery of the active-matrix substrate 13 of a smallsize. This enables the active-matrix substrate 13 to be combined withthe base substrate without seeping of the first filler 15, thusimproving workability. Further, the provision of the sealant 14 preventsthe first filler 15 from flowing into the seam (gap 13 c) of theactive-matrix substrates 13, thus preventing surface contamination ofthe active-matrix substrates 13 caused by the first filler 15. That is,there is provided a convenient method for providing the compositeactive-matrix substrate 11 a with the active-matrix substrates 13 firmlyfixed on the base substrate 12, without surface contamination of theactive-matrix substrates 13.

Further, because the first filler 15 used to combine each active-matrixsubstrate 13 with the base substrate 12 does not seep out to make up anexcess portion, the first filler 15 can be used efficiently. Further,because the base substrate 12 requires less umber of openings (adhesiveresin outlet) than conventionally, the cost associated with the openingscan be reduced. Additionally, by the provision of the sealant 14, aspacing (gap) created between each active-matrix substrate 13 and thebase substrate 12 can be completely parted from a spacing (gap) createdbetween the edges of adjacent active-matrix substrates 13. This makes itpossible to use fillers (adhesive resins) of different properties forthe first filler (adhesive resin) 15 combining the active-matrixsubstrates 13 with the base substrate 12, and the second filler(adhesive resin) 16 combining adjacent active-matrix substrates 13,which enables these fillers to be independently made of materialsoptimum for their purposes.

[Second Embodiment]

The following will describe another embodiment of the present inventionwith reference to the accompanying drawings. Note that, members havingthe same functions as those described in the First Embodiment are giventhe same reference numerals and explanations thereof are omitted here.Further, the scope of the present invention in any ways is not limitedby the following description of this embodiment.

As with the composite active-matrix substrate 11 a of the FirstEmbodiment, a composite active-matrix substrate 11 b according to thepresent embodiment includes a single large-area base substrate 12 andtwo active-matrix substrates 13, wherein the former is combined with thelatter with active element bearing parts 13 a exposed on the surface(FIG. 6(a) and FIG. 6(b), FIG. 7). The difference from the FirstEmbodiment is the method of combining each active-matrix substrate 13with the base substrate 12, whereby, in the present embodiment, asingle-layer gel sticking material (gel sticking material) 25 is used inreplacement of the combination of the sealant 14 and the first filler15.

As shown in FIG. 7, a second filler (adhesive filler B) 16 fills a gap13 at the juncture of the two active-matrix substrates 13 to bond theedge of one active-matrix substrate 13 with that of the other. Notethat, specific examples of the gel sticking material 25 will be given inconnection with a manufacturing method of the composite active-matrixsubstrate 11 b.

Referring to FIG. 8(a) through FIG. 8(g), the following describes themanufacturing method of the composite active-matrix substrate 11 b. Notethat, steps (1) through (3) shown in FIG. 8(a) through FIG. 8(c) are asalready described in the First Embodiment, and no further explanation isgiven therefor (FIG. 3(a) through FIG. 3(c)).

The plurality of active-matrix substrates 13 with their top surfacesstuck on the stage 21 through steps (1) through (3) are combined withthe base substrate 12 in step (4) (FIG. 8(d)). In this step, a layer ofgel sticking material 25 is formed substantially entirely over onesurface of the base substrate 12, for which a glass substrate is usedfor example. The plurality of active-matrix substrates 13 and the basesubstrate 12 are pressed against each other preferably under reducedpressure to combine these substrates. Note that, the gel stickingmaterial 25 is only required to be present between the bottom surfacesof the active-matrix substrates 13 and the top surface of the basesubstrate 12, and as such, a layer of the gel sticking material 25 maybe disposed in some cases in the form of discrete islands only on thecorresponding positions on the bottom surface of each active-matrixsubstrate 13.

The gel sticking material 25 is a semi-solid which is prepared bysolidifying a suspension fluid or a solution fluid until fluidity islost and to the extent where the dead weight does not cause collapse ofthe semi-solid. The gel sticking material 25 also has stickiness whichallows the substrates to be combined. A specific example of such amaterial is a gel silicon resin (silicon gel). The gel silicon resin isparticularly preferable because it is chemically stable and has superiorheat resistance.

The gel sticking material 25 may be used in various forms. For example,the gel sticking material 25 may be prepared as a sheet (gel sheet) andstuck on the base substrate 12. Alternatively, the gel sticking material25 may be prepared from a coating solution with superior fluidity, whichis applied on the base substrate 12 by spin coating and thereafter curedto a desired level (gel), for example, by heating (hereinafter, such agel sticking material 25 will be called “gel coating”). The advantage ofthe gel coating over the gel sheets (especially those commerciallyavailable) is that it can be easily formed into a uniform thin film ofabout 100 μm by spin coating. Note that, a non-limiting example of sucha coating solution for the gel coating is the Dow Corning Toray SiliconeCo., Ltd. product SE1880 (a solution which turns into a silicon gel).

The base substrate 12 with the gel sticking material 25 is then combinedwith the active-matrix substrates 13 under reduced pressure (may beunder vacuum conditions). This enables the base substrate 12 and eachactive-matrix substrate 13 to be combined without trapping air bubblestherebetween. Further, because the gel sticking material 25 combiningthe base substrate 12 and the active-matrix substrates 13 has nofluidity but elasticity, seeping of the gel sticking material 25 is nota problem even though the sealant 14 of a frame structure (see FirstEmbodiment) is not provided, and accordingly no surface contamination ofthe active-matrix substrates 13 occurs.

In step (5), which is optional, the gel sticking material 25 may besubjected to heat treatment to improve adhesion (stickiness) of the gelsticking material 25 (see FIG. 8(e)). Note that, when the gel stickingmaterial 25 is the gel product of SE1880, it is particularly preferablethat the heat treatment be carried out for 30 minutes in the temperaturerange of from 120° C. to 180° C. Further, in order to prevent the gelsticking material 25 from being exposed, a sealant 26 may be optionallyprovided around the edges of the composite active-matrix substrate 11 bso as to seal the gel sticking material 25. Note that, the sealant 26 ismade of, for example, epoxy resin, and may alternatively be provided soas to surround the gel sticking material 25 between the active-matrixsubstrates 13 and the base substrate 12. The provision of the sealant 26prevents outflow of organic materials (contaminants) from the gelsticking material 25 when the composite active-matrix substrate 11 b iswashed in post-processes, and thereby prevents surface contamination ofthe active-matrix substrates 13. Note that, step (5) is not necessarilyrequired and the foregoing processes of step (5) are carried out asrequired.

In step (6), the second filler (adhesive filler B) 16 is injectedbetween edges of the active-matrix substrates 13 so as to bond the edgeof one active-matrix substrate 13 with that of the other (FIG. 8(f). Instep (7), the surface protecting film 20 is detached to obtain thecomposite active-matrix substrate 11 b. Note that, steps (6) and (7) areessentially the same as the corresponding steps already explained in theFirst Embodiment and no further explanation is given therefor in thepresent embodiment.

The manufacturing method of the composite active-matrix substrateaccording to the present embodiment uses a highly flexible gel material(gel sticking material 25) as an adhesive filler to fill a spacingbetween a plurality of small active-matrix substrates 13 and the basesubstrate 12. With the use of this gel material, the gap (spacing)between these substrates can be filled completely even when the gap isnot completely uniform due to large non-uniformity in thickness of theactive-matrix substrates 13 and/or the base substrate 12. Further, thegel sticking material 25 can also be provided easily between theactive-matrix substrates 13 and the base substrate 12 by applying thegel sticking material 25 on the active-matrix substrates 13 or on thebase substrate 12, and by combining these substrates together underreduced pressure.

Further, because the gel sticking material 25, which is highly flexible,has no fluidity, the gel sticking material 25 does not seep out from theseam (edges) of the active-matrix substrates 13 onto the surface whencombining the active-matrix substrates 13 with the base substrate 12. Asa result, it is possible to provide the composite active-matrixsubstrate 11 b with the active-matrix substrates 13 firmly fixed on thebase substrate 12, without surface contamination of the active-matrixsubstrates 13 caused by the gel sticking material 25.

Further, because the second filler (curable resin) 16 is injected bycapillary action between the edges (gap 13 c) of the active-matrixsubstrates 13, the surfaces of the active-matrix substrates 13 are freefrom the second filler 16, and the second filler 16 can be injectedwithout externally applying any physical force on the surfaces of theactive-matrix substrates 13. Accordingly, the surface protecting film 20will not be required, and even if it is used, only a minimum thickness(3 μm in the present embodiment) is required. As a result, onlynecessary protection is required and workability is improved. Further,when the gel sticking material 25 is a gel silicon resin (silicon gel),a chemically and thermally stable composite active-matrix substrate 11 bcan be provided.

[Third Embodiment]

The following will describe another embodiment of the present inventionwith reference to the accompanying drawings. Note that, members havingthe same functions as those described in the First and Second Embodimentare given the same reference numerals and explanations thereof areomitted here. Further, the scope of the present invention in any ways isnot limited by the following description of this embodiment.

As with the composite active-matrix substrates 11 a and 11 b of theFirst and Second Embodiments, a composite active-matrix substrate 11 caccording to the present embodiment includes a single large-area basesubstrate 12 and two active-matrix substrates 13, wherein the former iscombined with the latter with active element bearing parts 13 a exposedon the surface (FIG. 9(a) and FIG. 9(b), FIG. 10). The difference fromthe First and Second Embodiments is the method of combining eachactive-matrix substrate 13 with the base substrate 12, whereby, in thepresent embodiment, a double-sided adhesive sheet 35 having a stickinglayer on its top surface and bottom surface to combine the substrates isused instead of the combination of the sealant 14 and the first filler15, or the gel sticking material 25.

As shown in FIG. 10, a second filler (adhesive filler B) 16 fills a gap13 c at the juncture of the two active-matrix substrates 13 to bond theedge of one active-matrix substrate 13 with that of the other. Thesecond filler 16 also fills a gap between double-sided adhesive sheets35 which are disposed adjacent to each other below the gap 13 c so as toreduce a spacing between the active-matrix substrates 13 and the basesubstrate 12 as much as possible.

Referring to FIG. 11(a) through FIG. 11(g), the following describes themanufacturing method of the composite active-matrix substrate 11 c. Notethat, steps (1) through (3) shown in FIG. 11(a) through FIG. 11(c) areas already described in the First Embodiment, and no further explanationis given therefor (FIG. 3(a) through FIG. 3(c)).

The plurality of active-matrix substrates 13 with their top surfacestuck on the stage 21 through steps (1) through (3) are combined withthe base substrate 12 in step (4) (FIG. 11(d)). In this step, stripes ofdouble-sided adhesive layer 35 are formed substantially entirely overone surface of the base substrate 12, for which a glass substrate isused for example. The plurality of active-matrix substrates 13 and thebase substrate 12 are pressed against each other preferably underreduced pressure to combine and integrate these substrates. Note that,the double-sided adhesive sheet 35 may be disposed on the bottom surfaceof each active-matrix substrate 13, instead of the base substrate 12.

The double-sided adhesive sheet 35 may be provided in various forms aslong as it is in the form of a sheet having a sticking layer on its topsurface and bottom surface. Examples of such a double-sided adhesivesheet 35 include (1) a sheet with a base film whose top surface andbottom surface have a sticking layer, and (2) a sheet which is entirelymade of a base film having stickiness. Other examples includethermoplastic adhesive sheets used to form laminated glass.

The double-sided adhesive sheet 35 may be provided as a single sheet tocover substantially the entire surface of the base substrate 12, or morepreferably as a single sheet or a plurality of sheets which areindependently (discontinuously) provided for each active-matrixsubstrate 13 between the base substrate 12 and the active-matrixsubstrates 13. That is, it is preferable that two or more double-sidedadhesive sheets 35 are independently provided between the active-matrixsubstrates 13 and the base substrate 12. In this way, a spacing betweenthe active-matrix substrates 13 and the base substrate 12 would includeareas where the double-sided adhesive sheet 35 is not present and fromwhich air bubbles can be released. That is, it is possible to preventair-trapping between the double-sided adhesive sheet 35 and theactive-matrix substrates 13, and/or between the double-sided adhesivesheet 35 and the base substrate 12. Air-trapping can be prevented moreeffectively when the double-sided adhesive sheet 35 is stuck underreduced pressure (may be under vacuum conditions).

The method of independently providing two or more double-sided adhesivesheets 35 between the active-matrix substrates 13 and the base substrate12 is not particularly limited. For example, (1) the double-sidedadhesive sheet 35 may be provided in stripes, each in the form of a tapeextending in one direction, at certain intervals (stripe or latticepattern) (FIG. 10, FIG. 11(a) through FIG. 11(g)), or (2) thedouble-sided adhesive sheet 35 may be provided discontinuously in theform of discrete islands. It is particularly preferable that thedouble-sided adhesive sheet 35 be provided in stripes, each in the formof a tape with a width of 1 cm to 2 cm, at certain intervals.

Note that, the base film (sheet base) or the sticking layers ofdouble-sided adhesive sheet 35 may be made of a material, such as ametal filler, containing heat-conductive fine particles. In this case,it becomes easier to control the temperature of each active-matrixsubstrate 13 within a suitable range through the base substrate 12. Thisis advantageous in forming a film (e.g., a conversion layer(semiconductor film) to be described in the Fourth Embodiment) whoseproperty is easily changed by a deposition temperature on the compositeactive-matrix substrate 11 c (more specifically, active-matrixsubstrates 13), because the property of such a film can be ensured toexhibit a good level of performance. Note that, the particle size of theheat-conductive fine particles is not particularly limited as long as itis no larger than the gap between the active-matrix substrates 13 andthe base substrate 12. A non-limiting example of double-sided adhesivesheet 35 containing such heat-conductive fine particles is theheat-conductive double-sided tape No. 7090 provided by TeraokaSeisakusho Co., Ltd.

In step (5), which is optional, in order to prevent the double-sidedadhesive sheet 35 from being exposed, a sealant 26 may be optionallyprovided around the edges of the composite active-matrix substrate 11 cso as to seal the double-sided adhesive sheet 35 (FIG. 11(e)). Theprovision of the sealant 26 prevents outflow of organic materials(contaminants) from the double-sided adhesive sheet 35 when thecomposite active-matrix substrate 11 c is washed in post-processes, andthereby prevents surface contamination of the active-matrix substrates13. Note that, step (5) is not necessarily required and the foregoingprocesses of step (5) are carried out as required.

In step (6), the second filler (adhesive filler B) 16 is injectedbetween the edges of the active-matrix substrates 13 so as to bond theedge of one active-matrix substrate 13 with that of the other (FIG.11(f)). In step (7), the surface protecting film 20 is detached toobtain the composite active-matrix substrate 11 c. Note that, steps (6)and (7) are essentially the same as the corresponding steps alreadyexplained in the First Embodiment and no further explanation is giventherefor in the present embodiment.

The manufacturing method of the composite active-matrix substrateaccording to the present embodiment uses the double-sided adhesive sheet35 of a solid form as the adhesive filler to fill a spacing between eachactive-matrix substrate 13 and the base substrate 12, and therefore theadhesive filler does not seep out of the seam of the active-matrixsubstrates 13 onto the surface when these substrates are combinedtogether. As a result, it is possible to provide the compositeactive-matrix substrate 11 c with the active-matrix substrates 13 firmlyfixed on the base substrate 12, without surface contamination of theactive-matrix substrates 13 caused by the adhesive filler.

Further, the use of the double-sided adhesive sheet 35 as the adhesivefiller makes it easier to combine the active-matrix substrates 13 withthe base substrate 12. That is, there is provided a convenient methodfor providing the composite active-matrix substrate 11 c, without aprocess of coating or injecting the adhesive filler.

Note that, the foregoing First through Third Embodiments described thecase where two small active-matrix substrates 13 are combined to makethe composite active-matrix substrates 11 a through 11 c. However, thepresent invention is also applicable to composite active-matrixsubstrates which are fabricated by combining four or more active-matrixsubstrates 13 in the form of a grid.

[Fourth Embodiment]

The following will describe another embodiment of the present inventionwith reference to the accompanying drawings. Note that, members havingthe same functions as those described in the First through FourthEmbodiment are given the same reference numerals and explanationsthereof are omitted here. Further, the scope of the present invention inany ways is not limited by the following description of this embodiment.

As schematically shown in FIG. 12, an X-ray capturing device(electromagnetic wave capturing device) according to the presentembodiment includes: one of the composite active-matrix substrates 11 athrough 11 c of the First through Third Embodiments (“compositeactive-matrix substrate 11); a photo-electric conversion layer(conversion layer, conversion means) 41 which converts anelectromagnetic wave such as X-rays into electrical charge; a biaselectrode (bias applying electrode layer) 42 for applying a bias totransfer the generated charge to the composite active-matrix substrate11; a high voltage power source 43 for the bias electrode 42; and acharge detector 44 for detecting the generated charge of thephoto-electric conversion layer 41 from the composite active-matrixsubstrate 11. The photo-electric conversion layer 41 is provided so asto cover essentially the entire surface (active element bearing part 13a) of the active-matrix substrates 13, and the bias electrode 42 isstacked on the photo-electric conversion layer 41 so as to coveressentially the entire surface of the photo-electric conversion layer41.

The photo-electric conversion layer 41, the bias electrode 42, the highvoltage power source 43, and the charge detector 44 of the X-raycapturing device shown in FIG. 12 can be realized by the structures of aconventional electromagnetic wave capturing device. More specifically,the photo-electric conversion layer (photo-electric conversion film) 41is realized by various semiconductor films, depending on the type ofelectromagnetic wave used for irradiation. For example, when theelectromagnetic wave used for irradiation is the X-rays, a film made ofa-Se (amorphous selenium) having a thickness of 0.5 mm to 1.5 mm issuitably used, taking into consideration sensitivity to the X-rays, orworkability of the material for forming it into a film with respect tothe large-area substrate (composite active-matrix substrate 11). Thebias electrode 42 is a thin film of, for example, Au or Al to apply abias to the photo-electric conversion layer 41.

Irradiation of the photo-electric conversion layer 41 with the X-raysgenerates charge of electron-hole pairs in the photo-electric conversionlayer 41. The generated charge (electrons or holes) moves toward thebias electrode 42 or the composite active-matrix substrate 11 accordingto the bias polarity applied to the photo-electric conversion layer 41.The charge drawn to the composite active-matrix substrate 11 is storedin a storage capacitor which is provided for each pixel of theactive-matrix substrates 13. The stored charge is detected by the chargedetector 44 through the active element (TFT element), and the chargedetector 44 obtains a two-dimensional X-ray image in the form ofdistribution information of charge.

Such an X-ray capturing device employing the active-matrix substrates isoften used in a medical field for x-ray radiography. In such anapplication, the captured area is relatively large, as in the case ofcapturing the image of human chest, and accordingly the device needs tohave a certain capturing area. Generally, the active-matrix substrateused in electromagnetic wave capturing devices is an insulatingsubstrate, such as a glass substrate, which comprises a fine-pitch arrayof metal wiring and semiconductor TFTs. Fabrication of such anactive-matrix substrate requires highly sophisticated processingtechniques such as photolithography, or expensive manufacture equipment.Therefore, it was difficult conventionally to manufacture a large-areaactive-matrix substrate because the yield decreased drastically in themanufacturing process as the area or resolution of the active-matrixsubstrate was increased. Further, it was impossible to fabricate anactive-matrix substrate which is larger than the size specified bypre-existing manufacture equipment.

These conventional problems can be solved and a large-area yetinexpensive capturing device can be provided by fabricating thecomposite active-matrix substrate 11 by connecting, for example, two orfour small active-matrix substrates 13 in the described manner. Further,a large-area active-matrix substrate (composite active-matrix substrate11) can be provided without large capital investment by joiningindividual active-matrix substrates 13 which were fabricated bypre-existing manufacture equipment.

The structure shown in FIG. 12 is of an X-ray capturing device of adirect conversion type in which X-rays are directly converted intoelectrical charge. However, the composite active-matrix substrate 11according to the present invention is also applicable to other types ofcapturing devices or may be used in display devices. An example of othertypes of capturing devices is an X-ray capturing device of an indirectconversion type, which is made up of: a photo-electric conversion panelprovided with an active element (TFT, switching element) and aphoto-electric conversion element (photo diode or photo transistor,conversion means) for each pixel of the composite active-matrixsubstrate 11; and a scintillator, provided on the photo-electricconversion panel (i.e., on the top surfaces of the active-matrixsubstrates 13), for converting electromagnetic waves such as X-rays intolight (particularly, visible light). In the X-ray capturing device of anindirect conversion type, the irradiated electromagnetic wave is firstconverted into light by the scintillator and then into charge by thephoto-electric conversion element. Note that, the electromagnetic wavewhich irradiates the X-ray capturing device of an indirect conversiontype may be any electromagnetic wave except light, and radiation rayssuch as X-rays are most commonly used. The display devices may be ofvarious kinds which use the active-matrix substrate, for example, suchas liquid crystal display devices and electroluminescent displaydevices.

Note that, in the event where the composite active-matrix substrateaccording to the present invention is used for an electromagnetic wavecapturing device, the seam or seams of the composite active-matrixsubstrates need not be taken into consideration in the fabricationprocess, contrary to the case of display devices, because the junctures(edges) of the active-matrix substrates do not pose any problem for theobserver. Further, in the case of electromagnetic wave capturingdevices, optical characteristics (refractive index, transmissivity,etc.) of the base substrate, the first filler, and the second filler arenot a concern unlike the case of display devices. Therefore, thecomposite active-matrix substrate of the present invention can be moreappreciably used for electromagnetic wave capturing devices than fordisplay devices, because electromagnetic wave capturing devices imposeless restriction on the constituting members.

As described, a composite active-matrix substrate according to thepresent invention includes: a plurality of active-matrix substrates,each having a top surface with an active element, which are disposedadjacent to one another so that the top surfaces of the active-matrixsubstrates make up a substantially level surface; a base substrate,which is provided so as to oppose a bottom surface of the active-matrixsubstrates; a sealant, which is provided in the form of a frame betweenthe bottom surface of each active-matrix substrate and the basesubstrate; an adhesive filler A, which fills a spacing surrounded by thebase substrate, the sealant, and each active-matrix substrate; and anadhesive filler B, which fills a gap between edges of the active-matrixsubstrates which are disposed adjacent to one another.

According to this arrangement, a spacing A (spacing filled with adhesivefiller A) between each active-matrix substrate and the base substrate iscompletely separated from a spacing B (spacing filled with adhesivefiller B) between edges of adjacent active-matrix substrates. Therefore,the adhesive filler A does not seep out of the spacing A and into thespacing B in particular. As a result, it is possible to provide acomposite active-matrix substrate with the active-matrix substratesfirmly fixed on the base substrate, without surface contamination of theactive-matrix substrates caused by the adhesive filler A.

Further, because the spacing A and spacing B are separated from eachother by the sealant, the adhesive filler A for adhering eachactive-matrix substrate with the base substrate and the adhesive fillerB for combining adjacent active-matrix substrates can have differentproperties according to their purposes.

Further, because the adhesive filler A does not seep out when combiningthe active-matrix substrates with the base substrate, the adhesivefiller A can be used more efficiently and the efficiency of combiningthe active-matrix substrates and the base substrate can be improved.

In the composite active-matrix substrate according to the presentinvention having the foregoing arrangement, the adhesive filler Apreferably comprises a light curable resin.

According to this arrangement, the adhesive filler A can fill thespacing A surrounded by the sealant while maintaining its relatively lowviscosity, because curing of the light curable resin is not promotedunless there is irradiation of light such as the UV light. In addition,once the injection of the adhesive filler A is finished, it can be curedquickly by irradiation of light such as the UV light. That is, theadhesive filler A can be injected and cured more smoothly, thusproviding a composite active-matrix substrate which can be fabricatedconveniently.

In the active-matrix substrate according to the present invention havingthe foregoing arrangement, it is preferable that a gap retainer isprovided between the base substrate and each active-matrix substrate.

According to this arrangement, the gap between each active-matrixsubstrate and the base substrate can be maintained constant by the gapretainer, so that the adhesive filler A can have a uniform thickness. Asa result, the composite active-matrix substrate can be provided withimproved surface flatness of each active-matrix substrate.

As described, another composite active-matrix substrate according to thepresent invention includes: a plurality of active-matrix substrates,each having a top surface with an active element, which are disposedadjacent to one another so that the top surfaces of the active-matrixsubstrates make up a substantially level surface; a base substrate,which is provided so as to oppose a bottom surface of the active-matrixsubstrates; a gel sticking material, which is provided between thebottom surface of each active-matrix substrate and the base substrate,for combining each active-matrix substrate with the base substrate; andan adhesive filler B, which fills a gap between edges of theactive-matrix substrates which are disposed adjacent to one another.

According to this arrangement, since the adhesive filler which fills aspacing between each active-matrix substrate and the base substrate is agel sticking material which has high flexibility but no fluidity, theadhesive filler (gel sticking material) does not seep out (flow out)through the seam or seams (edges) of adjacent active-matrix substrateswhen combining the active-matrix substrates with the base substrate. Asa result, it is possible to provide a composite active-matrix substratewith each active-matrix substrate firmly fixed on the base substrate,without surface contamination of the active-matrix substrates caused bythe adhesive filler (gel sticking material).

Further, the gel sticking material, because it is flexible, cancompletely fill a spacing between each active-matrix substrate and thebase substrate, even when the thickness of the active-matrix substrateor base substrate has a high degree of non-uniformity to cause anon-uniform gap between the two substrates. Further, the adhesive filler(gel sticking material) can easily be injected between the active-matrixsubstrate and the base substrate by applying the gel sticking materialonto the active-matrix substrate or the base substrate and by combiningit with the other substrate under reduced pressure.

In the composite active-matrix substrate according to the presentinvention having the foregoing arrangement, the gel sticking material ispreferably a silicon gel.

According to this arrangement, since a silicon gel is a chemicallystable material and has good heat resistance, a chemically and thermallystable composite active-matrix substrate can be provided.

It is preferable that the composite active-matrix substrate according tothe present invention having the foregoing arrangement includes asealant which is provided so as to surround the gel sticking material.

According to this arrangement, because the sealant is provided toprevent the gel sticking material from being exposed, seeping of organicimpurity from the gel sticking material in washing can be held to aminimum. As a result, it is possible to provide a compositeactive-matrix substrate without surface contamination of theactive-matrix substrates.

As described, another composite active-matrix substrate according to thepresent invention includes: a plurality of active-matrix substrates,each having a top surface with an active element, which are disposedadjacent to one another so that the top surfaces of the active-matrixsubstrates make up a substantially level surface; a base substrate,which is provided so as to oppose a bottom surface of the active-matrixsubstrates; a double-sided adhesive sheet, provided between the bottomsurface of each active-matrix substrate and the base substrate, having atop surface and a bottom surface respectively provided with stickinglayers for combining the base substrate with each active-matrixsubstrate; and an adhesive filler B, which fills a gap between edges ofthe active-matrix substrates which are disposed adjacent to one another.

According to this arrangement, since the adhesive filler used to fill aspacing between each active-matrix substrate and the base substrate isthe double-sided adhesive sheet of a solid form, the adhesive fillerdoes not seep out through the seam or seams of the adjacentactive-matrix substrates onto the surface when the active-matrixsubstrates are combined with the base substrate. As a result, it ispossible to provide a composite active-matrix substrate with eachactive-matrix substrate firmly fixed on the base substrate, withoutsurface contamination of the active-matrix substrates caused by theadhesive filler.

Further, the double-sided adhesive sheet used as the adhesive fillermakes it easier to combine the active-matrix substrates with the basesubstrate. That is, the composite active-matrix substrate can befabricated more easily without a process of applying or injecting theadhesive filler.

In the composite active-matrix substrate according to the presentinvention having the foregoing arrangement, the double-sided adhesivesheet preferably includes heat-conductive particles.

This makes it easier to control the temperature of the active-matrixsubstrates from the side of the base substrate. As a result, it ispossible to provide a composite active-matrix substrate which can easilycontrol the substrate temperature within a suitable range when forming afilm whose property is easily changed by a deposition temperature (e.g.,a conversion layer (semiconductor film)) on the composite active-matrixsubstrate.

It is preferable in the composite active-matrix substrate according tothe present invention having the foregoing arrangement that thedouble-sided adhesive sheet is disposed discontinuously so that at leastone double-sided adhesive sheet is provided between the base substrateand the bottom surface of each active-matrix substrate.

According to this arrangement, since the double-sided sheet is provideddiscontinuously in the form of stripes or discrete islands, air bubblescan be released from areas where the double-sided adhesive sheet is notpresent. That is, it is possible to provide a composite active-matrixsubstrate with the active-matrix substrates and the base substratefirmly combined together, with a minimum occurrence of air-trappingtherebetween.

In the composite active-matrix substrate according to the presentinvention having the foregoing arrangement, the adhesive filler B ispreferably an adhesive resin which is curable in the presence of air.

According to this arrangement, the adhesive filler. B can besufficiently cured even at the seam (edges) of the adjacentactive-matrix substrates where the adhesive filler B is exposed (incontact with air), and therefore no tacking remains on the exposedsurface of the adhesive filler B. As a result, it is possible to providea composite active-matrix substrate which can minimize seeping oforganic impurity from the exposed surface of the adhesive filler Bduring washing, and therefore is free from surface contamination of theactive-matrix substrates.

As described, an electromagnetic wave capturing device according to thepresent invention includes: one of the foregoing composite active-matrixsubstrates; a conversion layer, provided on the top surface of theactive-matrix substrates, for converting an electromagnetic wave intoelectrical charge; and a bias applying electrode layer provided on theconversion layer.

Further, another electromagnetic wave capturing device according to thepresent invention includes: one of the foregoing composite active-matrixsubstrates; a scintillator, provided on the top surface of theactive-matrix substrates, for converting an electromagnetic wave intolight; and a photo-electric conversion element, provided on theactive-matrix substrates, for converting light into electrical charge.

According to either arrangement, with the use of the compositeactive-matrix substrate which is composed of a plurality ofactive-matrix substrates tiled one another, a large-area yet inexpensiveelectromagnetic wave capturing device can be provided.

A method for manufacturing a composite active-matrix substrate accordingto the present invention is for manufacturing a composite active-matrixsubstrate which includes: a plurality of active-matrix substrates, eachhaving a top surface with an active element, which are disposed adjacentto one another so that the top surfaces of the active-matrix substratesmake up a substantially level surface; and a base substrate, which isprovided so as to oppose a bottom surface of the active-matrixsubstrates, and the method includes the steps of: forming a sealant inthe form of a frame between the base substrate and the bottom surface ofeach active-matrix substrate, so as to connect the base substrate witheach active-matrix substrate via a sealant; and injecting an adhesivefiller A into a spacing surrounded by the base substrate, the sealant,and each active-matrix substrate through an opening which opens into thespacing through at least one of the base substrate, the sealant, andeach active-matrix substrate.

According to this method, a spacing (spacing filled with the adhesivefiller A) between each active-matrix substrate and the base substrate,except for a portion where the opening is provided, is completelyseparated from outside by the sealant. Therefore, the adhesive filler Adoes not seep out of the spacing to contaminate the surface of eachactive-matrix substrate, thus further improving the efficiency of usingthe adhesive filler A and the efficiency of combining the active-matrixsubstrates with the base substrate.

Another method for manufacturing a composite active-matrix substrateaccording to the present invention is for manufacturing a compositeactive-matrix substrate which includes: a plurality of active-matrixsubstrates, each having a top surface with an active element, which aredisposed adjacent to one another so that the top surfaces of theactive-matrix substrates make up a substantially level surface; and abase substrate, which is provided so as to oppose a bottom surface ofthe active-matrix substrates, and the method includes the steps of:providing a gel sticking material between the base substrate and thebottom surface of each active-matrix substrate; and combining the basesubstrate and the active-matrix substrates with the gel stickingmaterial.

According to this method, the adhesive filler used to fill a spacingbetween each active-matrix substrate and the base substrate is the gelsticking material which has high flexibility but no fluidity, theadhesive filler (gel sticking material) does not contaminate the surfaceof each active-matrix substrate when the active-matrix substrate iscombined with the base substrate. Further, the gel sticking material,because it is flexible, can completely fill the gap between the twosubstrates.

Another method for manufacturing a composite active-matrix substrateaccording to the present invention is for manufacturing a compositeactive-matrix substrate which includes: a plurality of active-matrixsubstrates, each having a top surface with an active element, which aredisposed adjacent to one another so that the top surfaces of theactive-matrix substrates make up a substantially level surface; and abase substrate, which is provided so as to oppose a bottom surface ofthe active-matrix substrates, and the method includes the steps of:providing, between the base substrate and the bottom surface of eachactive-matrix substrate, a double-sided adhesive sheet having a topsurface and a bottom surface respectively provided with sticking layers;and combining the base substrate and the active-matrix substrates withthe double-sided adhesive sheet.

According to this method, since the adhesive filler used to fill aspacing between each active-matrix substrate and the base substrate isthe double-sided adhesive sheet of a solid form, it is possible toprevent surface contamination of each active-matrix substrate, which maybe caused by the adhesive filler when combining the two substrates.

It is preferable that the method for manufacturing a compositeactive-matrix substrate further includes the step of: injecting anadhesive filler B by capillary action between edges of the active-matrixsubstrates which are disposed adjacent to one another, so as to bond theactive-matrix substrates with one another.

According to this method, the adhesive filler B can be injected betweenedges of the active-matrix substrates without causing the adhesivefiller B to stick to the top surface of the active-matrix substrates,and without externally applying any physical force onto the top surfaceof each active-matrix substrate. As a result, surface contamination ofthe active-matrix substrates by the adhesive filler B can be prevented.Further, in the manufacturing steps, the protective film for protectingthe surface of each active-matrix substrate can be eliminated entirely,or only a minimum required thickness is required therefor. As a result,only necessary protection is required and workability is furtherimproved.

As described, another method for manufacturing a composite active-matrixsubstrate according to the present invention is for manufacturing acomposite active-matrix substrate which includes: a plurality ofactive-matrix substrates, each having a top surface with an activeelement, which are disposed adjacent to one another so that the topsurfaces of the active-matrix substrates make up a substantially levelsurface; and a base substrate, which is provided so as to oppose abottom surface of the active-matrix substrates, and the method includesthe steps of: fixing the active-matrix substrates on the base substrateso that the top surfaces of the active-matrix substrates disposedadjacent to one another make up a substantially level surface; andinjecting an adhesive filler B by capillary action between edges of theactive-matrix substrates which are disposed adjacent to one another, soas to bond the active-matrix substrates with one another.

According to this method, the adhesive filler B can be injected betweenedges of the active-matrix substrates without causing the adhesivefiller B to stick to the top surface of the active-matrix substrates,and without externally applying any physical force onto the top surfaceof each active-matrix substrate. As a result, surface contamination ofthe active-matrix substrates by the adhesive filler B can be prevented.Further, in the manufacturing steps, the protective film for protectingthe surface of each active-matrix substrate can be eliminated entirely,or only a minimum required thickness is required therefor. As a result,only necessary protection is required and workability is furtherimproved.

As described, it is preferable in the method for manufacturing acomposite active-matrix substrate according to the present inventionthat the adhesive filler B filling a gap between the edges of theactive-matrix substrates has a viscosity value in a range of from 5 cPto 200 cP, inclusive.

According to this method, the adhesive filler B can be injected smoothlyinto a gap between edges of the active-matrix substrates by capillaryaction.

As described, it is preferable in the method for manufacturing acomposite active-matrix substrate according to the present inventionthat the active-matrix substrates are fixed on the base substrate sothat a gap between the edges of the active-matrix substrates is in arange of from 20 μm to 150 μm, inclusive.

According to this method, the adhesive filler B can be injected smoothlyinto a gap between edges of the active-matrix substrates by capillaryaction.

The invention being thus described, it will be obvious that the same waymay be varied in many ways. Such variations are not to be regarded as adeparture from the spirit and scope of the invention, and all suchmodifications as would be obvious to one skilled in the art are intendedto be included within the scope of the following claims.

What is claimed is:
 1. A composite active-matrix substrate, comprising: a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface; a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates; a sealant, which is provided in the form of a frame between the bottom surface of each active-matrix substrate and the base substrate; a first adhesive filler, which fills a spacing surrounded by the base substrate, the sealant, and each active-matrix substrate; and a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another.
 2. The composite active-matrix substrate as set forth in claim 1, wherein the first adhesive filler comprises a light curable resin.
 3. The composite active-matrix substrate as set forth in claim 1, wherein a gap retainer is provided between the base substrate and each active-matrix substrate.
 4. The composite active-matrix substrate as set forth in claim 1, wherein the second adhesive filler is an adhesive resin which is curable in the presence of air.
 5. An electromagnetic wave capturing device, comprising: (I) a composite active-matrix substrate which is provided with: a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface; a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates; a sealant, which is provided in the form of a frame between the bottom surface of each active-matrix substrate and the base substrate; a first adhesive filler, which fills a spacing surrounded by the base substrate, the sealant, and each active-matrix substrate; and a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another; and (II) a conversion layer, provided on the top surface of the active-matrix substrates, for converting an electromagnetic wave into electrical charge; and (III) a bias applying electrode layer provided on the conversion layer.
 6. An electromagnetic wave capturing device, comprising: (I) a composite active-matrix substrate which is provided with: a plurality of active-matrix substrates, each having a top surface with an active element, which are disposed adjacent to one another so that the top surfaces of the active-matrix substrates make up a substantially level surface; a base substrate, which is provided so as to oppose a bottom surface of the active-matrix substrates; a sealant, which is provided in the form of a frame between the bottom surface of each active-matrix substrate and the base substrate; a first adhesive filler, which fills a spacing surrounded by the base substrate, the sealant, and each active-matrix substrate; and a second adhesive filler, which fills a gap between edges of the active-matrix substrates which are disposed adjacent to one another; and (II) a scintillator, provided on the top surface of the active-matrix substrates, for converting an electromagnetic wave into light; and (III) a photo-electric conversion element, provided on the active-matrix substrates, for converting light into electrical charge. 